60-3-5 - 

Soder-Wick® No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid.
Soder-Wick® No Clean packaged in ESD-safe static dissipative bobbins
Minimizes the risk of damage associated with static electricity
Patented noncorrosive, halide free, organic no-clean flux
Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance