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2204-8SQ - 

Solder Mask; Squeeze Bottle; 5 to 30 mils; Water; 30 Minute @ 65 degC; 8 Oz.

TechSpray 2204-8SQ
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制造商產(chǎn)品編號：
2204-8SQ
倉庫庫存編號：
70207175
技術(shù)數(shù)據(jù)表：
View 2204-8SQ Datasheet Datasheet
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2204-8SQ產(chǎn)品概述

Ideal water-washable mask for closed-loop systems. Quickly and easily removed with in-line and batch cleaning system.
Safe on ion beds & filters in closed-loop cleaning systems
100% water-soluble
Non-ozone depleting
Non-corrosive
Low odor

2204-8SQ產(chǎn)品信息

  Application  Safe on Precious Metals, Sensitive Contacts Protecting , Plated Through Holes and Contact Surfaces  
  Brand/Series  2204 Series  
  Chemical Component  Colloidal Silicon Dioxide/Dye/Methanol/Non-Ionic Proprietary Material/Surfactants  
  Dispensing Method  Bottle  
  Primary Type  Coating  
  Shelf Life  NONPERISHABLE-no shelf life limitations  
  Solubility  Water  
  Thickness  5 to 30 mils  
  Time, Cure  30 Minute @ 65 °C  
  Time, Setting  15 to 30 min.  
  Type  Solder Mask  
  Viscosity  11500 to 15500 cps  
  Weight  8 Oz.  
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2204-8SQ相關(guān)搜索

Application Safe on Precious Metals, Sensitive Contacts Protecting , Plated Through Holes and Contact Surfaces  TechSpray Application Safe on Precious Metals, Sensitive Contacts Protecting , Plated Through Holes and Contact Surfaces  Solder Masks Application Safe on Precious Metals, Sensitive Contacts Protecting , Plated Through Holes and Contact Surfaces  TechSpray Solder Masks Application Safe on Precious Metals, Sensitive Contacts Protecting , Plated Through Holes and Contact Surfaces   Brand/Series 2204 Series  TechSpray Brand/Series 2204 Series  Solder Masks Brand/Series 2204 Series  TechSpray Solder Masks Brand/Series 2204 Series   Chemical Component Colloidal Silicon Dioxide/Dye/Methanol/Non-Ionic Proprietary Material/Surfactants  TechSpray Chemical Component Colloidal Silicon Dioxide/Dye/Methanol/Non-Ionic Proprietary Material/Surfactants  Solder Masks Chemical Component Colloidal Silicon Dioxide/Dye/Methanol/Non-Ionic Proprietary Material/Surfactants  TechSpray Solder Masks Chemical Component Colloidal Silicon Dioxide/Dye/Methanol/Non-Ionic Proprietary Material/Surfactants   Dispensing Method Bottle  TechSpray Dispensing Method Bottle  Solder Masks Dispensing Method Bottle  TechSpray Solder Masks Dispensing Method Bottle   Primary Type Coating  TechSpray Primary Type Coating  Solder Masks Primary Type Coating  TechSpray Solder Masks Primary Type Coating   Shelf Life NONPERISHABLE-no shelf life limitations  TechSpray Shelf Life NONPERISHABLE-no shelf life limitations  Solder Masks Shelf Life NONPERISHABLE-no shelf life limitations  TechSpray Solder Masks Shelf Life NONPERISHABLE-no shelf life limitations   Solubility Water  TechSpray Solubility Water  Solder Masks Solubility Water  TechSpray Solder Masks Solubility Water   Thickness 5 to 30 mils  TechSpray Thickness 5 to 30 mils  Solder Masks Thickness 5 to 30 mils  TechSpray Solder Masks Thickness 5 to 30 mils   Time, Cure 30 Minute @ 65 °C  TechSpray Time, Cure 30 Minute @ 65 °C  Solder Masks Time, Cure 30 Minute @ 65 °C  TechSpray Solder Masks Time, Cure 30 Minute @ 65 °C   Time, Setting 15 to 30 min.  TechSpray Time, Setting 15 to 30 min.  Solder Masks Time, Setting 15 to 30 min.  TechSpray Solder Masks Time, Setting 15 to 30 min.   Type Solder Mask  TechSpray Type Solder Mask  Solder Masks Type Solder Mask  TechSpray Solder Masks Type Solder Mask   Viscosity 11500 to 15500 cps  TechSpray Viscosity 11500 to 15500 cps  Solder Masks Viscosity 11500 to 15500 cps  TechSpray Solder Masks Viscosity 11500 to 15500 cps   Weight 8 Oz.  TechSpray Weight 8 Oz.  Solder Masks Weight 8 Oz.  TechSpray Solder Masks Weight 8 Oz.  
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